Chip Condition

Chip Condition is graded on the physical condition of chip. The condition of the chip depends on the quality of manufacturing and the chip's wear and tear. The Common Chip Grading Methodology (CCGM) provides for a 100 point scale, not dissimilar to coin grading. However, to attempt to reduce judgment variations, scores for individual components are awarded on a 10 point scale. The general rule for grading is that a 10 is perfection, a 0 is scrap, and significant distractions are a 5. All scores are not equal. Lower scores are weighted heavier because of the impact to the visual appeal of the chip.

Condition Score
Scale	Condition
10	Perfect/Flawless
9	Flaw not visible on casual inspection
7	Minor Detraction
5	Significant Detraction
2	Major Detraction
0	Scrap

Following the process outlined below, a chip is ultimately assigned a Chip Grade (CG). Terminology for grades is outlined below:

Chip Grades
Mint	CG-98+
Near Mint	CG-90
Excellent	CG-80
Fine	CG-70
Good	CG-60
Fair	CG-50
Poor	CG-25

Common Chip Grading Methodology - CCGM

This CCGM was developed to give chip collectors a common terminology to describe the condition of chips. As with any human analysis judgment, opinion, and bias will always cause variability. The CCGM process provides guidance to commonly express the condition of chips. The process has been simplified as much as possible, but still provides weight to those factors that give the strongest impressions of a chip.

The CCGM Process

For the chip, complete the appropriate CCGM grading matrix. For chips that have metal surfaces other than the leads then choose the Metal Surface Matrix, otherwise choose Non-Metal Surface Matrix. Score each of the Component Factors, according to the Condition Grading Guidelines table. Weights are established by the score given:

Score Weight
Score	Weight
10	1
9	1
8	2
7	3
6	5
5	7
4	11
3	17
2	25
1	38
0	57

In addition to weight in the table an Impact Weight must be applied. Impact Weight attempts to account for in the visual and psychological impact of various defects.

Impact Weight
Factor	Weight
Coloration	1
Alignment and Centering	1
Manufacturing Defects	2
Edges Sharp and Clear	2
Print Coloration	4
Scuffs/Scraps	4
Chips or Cracks	8
Dents, Cracks, Corrosion	8
Creases, Cracks, Corrosion	8
Print Irregularities	8

Multiply the Score by the Score Weight and Impact Weight to determine each Weighted Score. Add all of the Weighted Scores to determine the Total Weighted Score. To determine the Chip Grade, divide the Total Weighted Score by the sum of the weights in Weight column.

This matrix is used for ceramic or plastic chips with metal surfaces, such as lids, other than leads.

CCGM Grading Matrix (Metal Surface )
Component	Factors	Score	Weight	Weighted Score
Ceramic/Plastic Package Surfaces	Coloration
	Manufacturing Defects
	Scuffs/Scratches
	Chips or Cracks
Metal Surfaces	Coloration
	Manufacturing Defects
	Scuffs/Scratches
	Dents, Cracks, Corrosion
Leads	Coloration
	Manufacturing Defects
	Scuffs/Scratches
	Creases, Cracks, Corrosion
Printing	Alignment and Centering
	Edges Sharp and Clear
	Print Coloration
	Print Irregularities
Total Weighted Score
Chip Grade =Total Weighted Score / Sum of Weights

Download a spreadsheet to calculate Chip Grades for Metal Surface Chips

This matrix is used for ceramic or plastic chips with no metal surfaces other than leads.

CCGM Grading Matrix (Non-Metal Surface )
Component	Factors	Score	Weight	Weighted Score
Ceramic/Plastic Package Surfaces	Coloration
	Manufacturing Defects
	Scuffs/Scratches
	Chips or Cracks
Leads	Coloration
	Manufacturing Defects
	Scuffs/Scratches
	Creases, Cracks, Corrosion
Printing	Alignment and Centering
	Edges Sharp and Clear
	Print Coloration
	Print Irregularities
Total Weighted Score
Chip Grade =Total Weighted Score / Sum of Weights

Download a spreadsheet to calculate Chip Grades for Non-Metal Surface Chips

This matrix is used for chips with all metal surfaces.

CCGM Grading Matrix (All Metal Surface )
Component	Factors	Score	Weight	Weighted Score
Metal Package Surfaces	Coloration
	Manufacturing Defects
	Scuffs/Scraps
	Manufacturing Defects
	Chips or Cracks
Leads	Coloration
	Manufacturing Defects
	Scuffs/Scratches
	Creases, Cracks, Corrosion
Printing	Alignment and Centering
	Edges Sharp and Clear
	Print Coloration
	Print Irregularities
Total Weighted Score
Chip Grade =Total Weighted Score / Sum of Weights

Download a spreadsheet to calculate Chip Grades for All Metal Surface Chips

Generally the displayed surface of a chip is most important and "dark" side imperfections are graded 1/2 the value of a "display" side flaw.

Condition Grading Guidelines
Component	Condition	10	5	0
Ceramic/ Plastic Surfaces	Coloration: the uniformity of the color of the surface, age fading, or chemically caused discolored areas of the package	Uniform bright	Noticeable and distracting discontinuities or blotches	Fading, mottling, blotches cover most of the surface and are the distracting focus of attention
	Manufacturing defects: proper alignment and form	None, no casting or machining defects	Noticeable and distracting alignment or deformities	Operation of the chip would be questioned
	Scuffs/Scraps: damage caused by contact with	None	Noticeable and distracting surface abrasions	Scuff/Scraps are the distracting focus of attention
	Chips or Cracks: surface broken and/or missing	None	Noticeable and distracting surface abrasions	Operation of the chip would be questioned
Metal Surfaces	Coloration: the uniformity of the color of the surface, age fading, or chemically caused discolored areas of the package	Uniform bright	Noticeable and distracting discontinuities or blotches	Fading, mottling, blotches cover most of the surface and are the distracting focus of attention
	Manufacturing defects: proper alignment and form	None, no casting or machining defects	Noticeable and distracting alignment or deformities	Operation of the chip would be questioned
	Scuffs, Scratches: buffed areas of a matte finish, thin shallow cuts	No Scuffs, minor hairline scratches	Noticeable and distracting scuffs and scratches in normal light	Scuffs and scratches are the focus of attention
	Dents, Chips, Cracks, Corrosion: surface broken, corrupted and/or missing	None	Noticeable and distracting surface abrasions	Operation of the chip would be questioned
Leads	Coloration: the uniformity of the color of the surface, age fading, or chemically caused discolored areas of the package	None	Noticeable and distracting discontinuities or botches on some leads	Blotches over most leads and are the distracting focus of attention
	Manufacturing defects: proper alignment and form	None, leads have crisp machined edges	Noticeable and distracting alignment or deformities	Operation of the chip would be questioned
	Scuffs, Scratches: buffed areas of a matte finish, thin shallow cuts	None	Noticeable and distracting botches on some leads	Scuffs and scratches over most leads and are the distracting focus of attention
	Creases, Cracks, Corrosion: creases causes by bent leads, leads broken, corrupted and/or missing	None, leads are straight and uniform	Noticeable and distracting lead abrasions on some leads	Lead abrasions on most leads, chip operation questionable
Printing	Alignment and Centering	Well centered and aligned	Noticeable and distracting centering or alignment	Extreme centering and alignment error, some printing missing, illegible
	Edges Sharp and Clear	Clear well defined edges	Noticeable and distracting irregular edges or blurring	Faded and mottled, illegible
	Print Coloration: the uniformity of the print color	Uniform bright	Noticeable and distracting discontinuities	Faded and mottled, illegible
	Print Irregularities	Characters complete, no damage	Noticeable and distracting sections missing	Characters mostly missing, illegible