{"id":73,"date":"2013-09-14T20:26:58","date_gmt":"2013-09-14T20:26:58","guid":{"rendered":"http:\/\/www.antiquetech.com\/?page_id=73"},"modified":"2013-09-14T20:28:15","modified_gmt":"2013-09-14T20:28:15","slug":"chip-condition","status":"publish","type":"page","link":"http:\/\/www.antiquetech.com\/?page_id=73","title":{"rendered":"Chip Condition"},"content":{"rendered":"

Chip Condition is graded on the physical condition of chip. The condition of the chip depends on the quality of manufacturing and the chip’s wear and tear. The Common Chip Grading Methodology (CCGM) provides for a 100 point scale, not dissimilar to coin grading. However, to attempt to reduce judgment variations, scores for individual components are awarded on a 10 point scale. The general rule for grading is that a 10 is perfection, a 0 is scrap, and significant distractions are a 5. All scores are not equal. Lower scores are weighted heavier because of the impact to the visual appeal of the chip.<\/p>\n

 <\/p>\n\n\n\n\n\n\n\n\n\n\n
Condition Score<\/b><\/span><\/td>\n<\/tr>\n
Scale<\/b><\/span><\/td>\nCondition<\/b><\/span><\/td>\n<\/tr>\n
10<\/span><\/td>\nPerfect\/Flawless\u00a0<\/span><\/td>\n<\/tr>\n
9<\/span><\/td>\nFlaw not visible on casual inspection<\/span><\/td>\n<\/tr>\n
7<\/span><\/td>\nMinor Detraction<\/span><\/td>\n<\/tr>\n
5<\/span><\/td>\nSignificant Detraction<\/span><\/td>\n<\/tr>\n
2<\/span><\/td>\nMajor Detraction<\/span><\/td>\n<\/tr>\n
0<\/span><\/td>\nScrap<\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

Following the process outlined below, a chip is ultimately assigned a Chip Grade (CG). Terminology for grades is outlined below:<\/p>\n\n\n\n\n\n\n\n\n\n\n
\n

Chip Grades<\/b><\/span><\/p>\n<\/td>\n<\/tr>\n

Mint<\/span><\/td>\nCG-98+<\/span><\/td>\n\"Mint_Chip\"<\/a><\/td>\n<\/tr>\n
Near Mint<\/span><\/td>\nCG-90<\/span><\/td>\n<\/td>\n<\/tr>\n
Excellent\u00a0<\/span><\/td>\nCG-80<\/span><\/td>\n<\/td>\n<\/tr>\n
Fine\u00a0<\/span><\/td>\nCG-70<\/span><\/td>\n<\/td>\n<\/tr>\n
Good<\/span><\/td>\nCG-60<\/span><\/td>\n<\/td>\n<\/tr>\n
Fair<\/span><\/td>\nCG-50<\/span><\/td>\n<\/td>\n<\/tr>\n
Poor<\/span><\/td>\nCG-25<\/span><\/td>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

 <\/p>\n

Common Chip Grading Methodology – CCGM<\/h2>\n

This CCGM was developed to give chip collectors a common terminology to describe the condition of chips. As with any human analysis judgment, opinion, and bias will always cause variability. The CCGM process provides guidance to commonly express the condition of chips.\u00a0The process has been simplified as much as possible, but still provides weight to those factors that give the strongest impressions of a chip.<\/p>\n

The CCGM Process<\/h3>\n

For the chip, complete the appropriate CCGM grading matrix. For chips that have metal surfaces other than the leads then choose the Metal Surface Matrix, otherwise choose Non-Metal Surface Matrix. Score each of the Component Factors, according to the Condition Grading Guidelines table. Weights are established by the score given:<\/p>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
\n

Score Weight<\/b><\/span><\/p>\n<\/td>\n<\/tr>\n

Score<\/b><\/span><\/td>\nWeight<\/b><\/span><\/td>\n<\/tr>\n
10<\/span><\/td>\n1<\/span><\/td>\n<\/tr>\n
9<\/span><\/td>\n1<\/span><\/td>\n<\/tr>\n
8<\/span><\/td>\n2<\/span><\/td>\n<\/tr>\n
7<\/span><\/td>\n3<\/span><\/td>\n<\/tr>\n
6<\/span><\/td>\n5<\/span><\/td>\n<\/tr>\n
5<\/span><\/td>\n7<\/span><\/td>\n<\/tr>\n
4<\/span><\/td>\n11<\/span><\/td>\n<\/tr>\n
3<\/span><\/td>\n17<\/span><\/td>\n<\/tr>\n
2<\/span><\/td>\n25<\/span><\/td>\n<\/tr>\n
1<\/span><\/td>\n38<\/span><\/td>\n<\/tr>\n
0<\/span><\/td>\n57<\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

In addition to weight in the table an Impact Weight must be applied. Impact Weight attempts to account for\u00a0 in the visual and psychological impact of various defects.<\/p>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
\n

Impact Weight<\/b><\/span><\/p>\n<\/td>\n<\/tr>\n

Factor<\/b><\/span><\/td>\nWeight<\/b><\/span><\/td>\n<\/tr>\n
Coloration<\/span><\/td>\n1<\/span><\/td>\n<\/tr>\n
Alignment and Centering<\/span><\/td>\n1<\/span><\/td>\n<\/tr>\n
Manufacturing Defects<\/span><\/td>\n2<\/span><\/td>\n<\/tr>\n
Edges Sharp and Clear<\/span><\/td>\n2<\/span><\/td>\n<\/tr>\n
Print Coloration<\/span><\/td>\n4<\/span><\/td>\n<\/tr>\n
Scuffs\/Scraps<\/span><\/td>\n4<\/span><\/td>\n<\/tr>\n
Chips or Cracks<\/span><\/td>\n8<\/span><\/td>\n<\/tr>\n
Dents, Cracks, Corrosion<\/span><\/td>\n8<\/span><\/td>\n<\/tr>\n
Creases, Cracks, Corrosion<\/span><\/td>\n8<\/span><\/td>\n<\/tr>\n
Print Irregularities<\/span><\/td>\n8<\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

Multiply the Score by the\u00a0 Score Weight and Impact Weight to determine each Weighted Score. Add all of the Weighted Scores to determine the Total Weighted Score. To determine the Chip Grade, divide the Total Weighted Score by the sum of the weights in Weight column.<\/p>\n

This matrix is used for ceramic or plastic chips with metal surfaces, such as lids, other than leads.<\/p>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
\n

CCGM Grading Matrix (Metal Surface )<\/b><\/p>\n

\u00a0<\/span><\/p>\n<\/td>\n<\/tr>\n

Component<\/b><\/span><\/td>\nFactors<\/b><\/span><\/td>\nScore<\/b><\/span><\/td>\nWeight<\/b><\/span><\/td>\nWeighted Score<\/b><\/span><\/td>\n<\/tr>\n
Ceramic\/Plastic Package Surfaces<\/span><\/td>\nColoration<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Manufacturing Defects<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Scuffs\/Scratches<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Chips or Cracks<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Metal Surfaces<\/span><\/td>\nColoration<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Manufacturing Defects<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Scuffs\/Scratches<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Dents, Cracks, Corrosion<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Leads<\/span><\/td>\nColoration<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Manufacturing Defects<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Scuffs\/Scratches<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Creases, Cracks, Corrosion<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Printing<\/span><\/td>\nAlignment and Centering<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Edges Sharp and Clear<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Print Coloration\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Print Irregularities<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Total Weighted Score<\/b><\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Chip Grade =<\/b>Total Weighted Score<\/b> \/ Sum of Weights\u00a0<\/b><\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

Download a spreadsheet to calculate Chip Grades for Metal Surface Chips<\/p>\n

 <\/p>\n

This matrix is used for ceramic or plastic chips with no metal surfaces other than leads.<\/p>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
\n

CCGM Grading Matrix (Non-Metal Surface )<\/b><\/p>\n

\u00a0<\/span><\/p>\n<\/td>\n<\/tr>\n

Component<\/b><\/span><\/td>\nFactors<\/b><\/span><\/td>\nScore<\/b><\/span><\/td>\nWeight<\/b><\/span><\/td>\nWeighted Score<\/b><\/span><\/td>\n<\/tr>\n
Ceramic\/Plastic Package Surfaces<\/span><\/td>\nColoration<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Manufacturing Defects<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Scuffs\/Scratches<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Chips or Cracks<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Leads<\/span><\/td>\nColoration<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Manufacturing Defects<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Scuffs\/Scratches<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Creases, Cracks, Corrosion<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Printing<\/span><\/td>\nAlignment and Centering<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Edges Sharp and Clear<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Print Coloration\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Print Irregularities<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Total Weighted Score<\/b><\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Chip Grade =<\/b>Total Weighted Score<\/b> \/ Sum of Weights\u00a0<\/b><\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

Download a spreadsheet to calculate Chip Grades for Non-Metal Surface Chips<\/p>\n

 <\/p>\n

This matrix is used for chips with all metal surfaces.<\/p>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
\n

CCGM Grading Matrix (All Metal Surface )<\/b><\/p>\n

\u00a0<\/span><\/p>\n<\/td>\n<\/tr>\n

Component<\/b><\/span><\/td>\nFactors<\/b><\/span><\/td>\nScore<\/b><\/span><\/td>\nWeight<\/b><\/span><\/td>\nWeighted Score<\/b><\/span><\/td>\n<\/tr>\n
Metal Package Surfaces<\/span><\/td>\nColoration<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Manufacturing Defects<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Scuffs\/Scraps<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Manufacturing Defects<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Chips or Cracks<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Leads<\/span><\/td>\nColoration<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Manufacturing Defects<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Scuffs\/Scratches<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Creases, Cracks, Corrosion<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Printing<\/span><\/td>\nAlignment and Centering<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Edges Sharp and Clear<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Print Coloration\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Print Irregularities<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Total Weighted Score<\/b><\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n
Chip Grade =<\/b>Total Weighted Score<\/b> \/ Sum of Weights\u00a0<\/b><\/span><\/td>\n\u00a0<\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

Download a spreadsheet to calculate Chip Grades for All Metal Surface Chips<\/p>\n

 <\/p>\n

Generally the displayed surface of a chip is most important and “dark” side imperfections are graded 1\/2 the value of a “display” side flaw.<\/p>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
\n

Condition Grading Guidelines<\/b><\/p>\n

\u00a0<\/b><\/span><\/p>\n<\/td>\n<\/tr>\n

Component<\/b><\/span><\/td>\nCondition<\/b><\/span><\/td>\n\n

10<\/b><\/span><\/p>\n<\/td>\n

5<\/b><\/span><\/td>\n\n

0<\/b><\/span><\/p>\n<\/td>\n<\/tr>\n

Ceramic\/ Plastic Surfaces<\/b><\/span><\/td>\nColoration:\u00a0 the uniformity of the color of the surface, age fading, or chemically caused discolored areas of the package<\/span><\/td>\nUniform bright<\/span><\/td>\nNoticeable and distracting discontinuities or blotches<\/span><\/td>\nFading,\u00a0 mottling, blotches cover most of the surface\u00a0 and are the distracting focus of attention<\/span><\/td>\n<\/tr>\n
Manufacturing defects: proper alignment and form<\/span><\/td>\nNone, no casting or machining defects\u00a0<\/span><\/td>\nNoticeable and distracting alignment or deformities<\/span><\/td>\nOperation of the chip would be questioned<\/span><\/td>\n<\/tr>\n
Scuffs\/Scraps:\u00a0 damage caused by contact with\u00a0<\/span><\/td>\nNone<\/span><\/td>\nNoticeable and distracting surface abrasions<\/span><\/td>\nScuff\/Scraps are the distracting focus of attention<\/span><\/td>\n<\/tr>\n
Chips or Cracks:\u00a0 surface broken and\/or missing<\/span><\/td>\nNone<\/span><\/td>\nNoticeable and distracting surface abrasions<\/span><\/td>\nOperation of the chip would be questioned<\/span><\/td>\n<\/tr>\n
Metal Surfaces<\/b><\/span><\/td>\nColoration:\u00a0 the uniformity of the color of the surface, age fading, or chemically caused discolored areas of the package<\/span><\/td>\nUniform bright<\/span><\/td>\nNoticeable and distracting discontinuities or blotches<\/span><\/td>\nFading,\u00a0 mottling, blotches cover most of the surface and are the distracting focus of attention<\/span><\/td>\n<\/tr>\n
Manufacturing defects: proper alignment and form<\/span><\/td>\nNone, no casting or machining defects\u00a0<\/span><\/td>\nNoticeable and distracting alignment or deformities<\/span><\/td>\nOperation of the chip would be questioned<\/span><\/td>\n<\/tr>\n
Scuffs, Scratches:\u00a0 buffed areas of a matte finish, thin shallow cuts<\/span><\/td>\nNo Scuffs, minor hairline scratches<\/span><\/td>\nNoticeable and distracting scuffs and scratches in normal light<\/span><\/td>\nScuffs and scratches are the focus of attention<\/span><\/td>\n<\/tr>\n
Dents, Chips, Cracks, Corrosion:\u00a0 surface broken, corrupted and\/or missing<\/span><\/td>\nNone<\/span><\/td>\nNoticeable and distracting surface abrasions<\/span><\/td>\nOperation of the chip would be questioned<\/span><\/td>\n<\/tr>\n
Leads<\/b><\/span><\/td>\nColoration:\u00a0 the uniformity of the color of the surface, age fading, or chemically caused discolored areas of the package<\/span><\/td>\nNone<\/span><\/td>\nNoticeable and distracting discontinuities or botches on some leads<\/span><\/td>\nBlotches over most leads and are the distracting focus of attention<\/span><\/td>\n<\/tr>\n
Manufacturing defects: proper alignment and form<\/span><\/td>\nNone, leads have crisp machined edges<\/span><\/td>\nNoticeable and distracting alignment or deformities<\/span><\/td>\nOperation of the chip would be questioned<\/span><\/td>\n<\/tr>\n
Scuffs, Scratches:\u00a0 buffed areas of a matte finish, thin shallow cuts<\/span><\/td>\nNone<\/span><\/td>\nNoticeable and distracting botches on some leads<\/span><\/td>\nScuffs and scratches over most leads and are the distracting focus of attention<\/span><\/td>\n<\/tr>\n
Creases, Cracks, Corrosion: creases causes by bent leads, leads broken, corrupted and\/or missing<\/span><\/td>\nNone, leads are straight and uniform<\/span><\/td>\nNoticeable and distracting lead abrasions on some leads<\/span><\/td>\nLead abrasions on most leads, chip operation questionable<\/span><\/td>\n<\/tr>\n
Printing<\/b><\/span><\/td>\nAlignment and Centering<\/span><\/td>\nWell centered and aligned<\/span><\/td>\nNoticeable and distracting centering or alignment<\/span><\/td>\nExtreme centering and alignment error, some printing missing, illegible<\/span><\/td>\n<\/tr>\n
Edges Sharp and Clear<\/span><\/td>\nClear well defined edges<\/span><\/td>\nNoticeable and distracting irregular edges or blurring <\/span><\/td>\nFaded and mottled,\u00a0 illegible<\/span><\/td>\n<\/tr>\n
Print Coloration:\u00a0 the uniformity of the print color<\/span><\/td>\nUniform bright<\/span><\/td>\nNoticeable and distracting discontinuities<\/span><\/td>\nFaded and mottled,\u00a0 illegible<\/span><\/td>\n<\/tr>\n
Print Irregularities<\/span><\/td>\nCharacters complete, no damage<\/span><\/td>\nNoticeable and distracting sections missing <\/span><\/td>\nCharacters mostly missing, illegible<\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

\u00a0<\/span><\/p>\n","protected":false},"excerpt":{"rendered":"

Chip Condition is graded on the physical condition of chip. The condition of the chip depends on the quality of manufacturing and the chip’s wear and tear. The Common Chip Grading Methodology (CCGM) provides for a 100 point scale, not dissimilar to coin grading. However, to attempt to reduce judgment variations, scores for individual components … <\/p>\n

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