| P<\/b><\/span><\/td>\n | A<\/b><\/span><\/td>\n | B<\/b><\/span><\/td>\n | 999<\/b><\/span><\/td>\n | (V9 or -9)<\/b><\/span><\/td>\n | \/M<\/b><\/span><\/td>\n<\/tr>\n| Package *<\/b><\/span><\/td>\n | Chip ID #,<\/b><\/p>\n | 1st Digit<\/b><\/span><\/td>\n Chip ID #,<\/b><\/p>\n | 2nd Digit<\/b><\/span><\/td>\n Chip ID #,<\/b><\/p>\n | Sequence #<\/b><\/span><\/td>\n Version<\/b><\/p>\n | Control<\/b><\/span><\/td>\n Military<\/b><\/p>\n | Spec<\/b><\/span><\/td>\n<\/tr>\n A – Pin Grid Array<\/p>\n C – CerDIP<\/p>\n D- Ceramic Sandwich<\/p>\n P – Polymer Resin<\/p>\n R – CLCC<\/p>\n N – PLCC<\/p>\n <\/p>\n Others<\/b><\/p>\n Kx – Plastic Quad Flat Packs<\/p>\n K & Q – Ceramic\u00a0 Quad Flat Packs<\/p>\n <\/p>\n Others types exist, but are of newer vintages<\/span><\/td>\n 1 – PMOS chip<\/p>\n 2 – NMOS chip<\/p>\n 3 – Bipolar chip<\/p>\n 4 – 4-bit CPU’s<\/p>\n 5 – CMOS chip<\/p>\n 6 – NA<\/p>\n 7 – Bubble Memory<\/p>\n 8 – 8-bit+ CPU’s, MCU’s, Supports<\/p>\n 9 – NA<\/span><\/td>\n 1 – RAM<\/p>\n 2 – Support Chip<\/p>\n 3 – ROMs’<\/p>\n 4 – Shift Registers<\/p>\n 5 – EPLD<\/p>\n 6 – PROM<\/p>\n 7 – EPROM<\/p>\n 8 – Watch\/Timing Chips<\/p>\n 9 – Telecommunications<\/span><\/td>\n 99-9<\/span><\/td>\n A – 1st version<\/p>\n B – 2nd version<\/p>\n etc. or<\/p>\n SX, DX, etc.<\/p>\n <\/p>\n 9 =<\/p>\n indicates<\/p>\n sub-version<\/p>\n or<\/p>\n approximate<\/p>\n speed in Mhz<\/span><\/td>\n <\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n <\/p>\n * Modifiers sometimes found in front of the Package type:<\/p>\n A -Automotive temperature range<\/p>\n I – Industrial Grade<\/p>\n L – Extended temperature range (-40C to 85C) express product with 160×8 hours burn-in<\/p>\n Q – Commercial temperature range with (0C to 70C) express product with 160×8 hours burn-in<\/p>\n T –\u00a0 Extended temperature range (-40C to 85C) express product with no burn-in<\/p><\/blockquote>\n Intel Date Code Format: YYWW<\/b><\/p>\n These number should be located by themselves with no letters or other numbers immediately adjacent. The numbers are often found on the underside with the country of manufacture.<\/p>\n WW – Week of manufacture. Ranges from 01 to 52.<\/p>\n YY – Year of manufacture. Ranges from 73 to 99.<\/p>\n Intel incorporated in 1968. Chips were not produced until 1971. Date codes were not used until 1973.<\/p>\n If the chip was not made in the US, it should have the country of manufacture spelled out clearly on the chip.<\/p>\n Test and Assembly Plants<\/b><\/p>\n Barbados (about 1981-86*)<\/p>\n Costa Rica (Fab A6\/T6), 1998)<\/p>\n Hong Kong (70’s, subcontractor?)<\/p>\n Penang, Malaysia (1972)<\/p>\n Kulim Hi-Tech Park, Malaysia (1974, “PC Boards”)<\/p>\n Shanghai, PR of China (1998)<\/p>\n Manila, Philippines (1983)<\/p>\n Mexico (70’s, subcontractor?)<\/p>\n USA<\/p>\n – Chandler, AZ (1996)<\/p>\n <\/p>\n Wafer Fab Plants<\/b><\/p>\n Leixlip, Ireland (Fab 10, 1994; Fab 14, 1998, 24, 2000)<\/p>\n Lachish-Kiryat Gat, Israel (Fab 18, 2000)<\/p>\n Jerusalem, Israel (Fab 8, 1985)<\/p>\n USA<\/p>\n – Chandler, AZ (Fabs 6, 1980-2000, Fab 12, 1997; Fab 22, 2001)<\/p>\n – Livermore, Ca (Fab 3)<\/p>\n – Mountain View, Ca (1668-76, “1st Fab”)<\/p>\n – Santa Clara, Ca (Fabs 1, 1971 & 2)<\/p>\n – Colorado Springs, Co (Fab 23, “Rockwell”)<\/p>\n – Hudson, MA (Fab 17 “DEC Fab 6”)<\/p>\n – Rio Rancho\/Albuquerque, NM (Fabs 7, 1983; 9.1; 9.2; 11)<\/p>\n – Aloha, Or (Fabs 4, 1976-97 ; 5, 1978; 15)<\/p>\n – Hilsboro, Or (Fabs 20, 1999)<\/p>\n – Fort Worth, TX (Fab 16, 2000)<\/td>\n The chip above was assembled in Intel’s Penang, Malaysia in the 12th week of 1975<\/span><\/p>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n <\/p>\n * I have not seen any start\/close dates. These dates are based on observations and best guesses.<\/p>\n <\/p>\n <\/p>\n This is the earliest date that company asserted its copyright to the chip design (there may be multiple dates). Many people confused this date for the date of manufacture. The copyright date and Date Code can differ by 15 years on some chips.<\/p>\n <\/p>\n Some chips may be released before full production. These chips are usually provided to other companies involved in developing related hardware or software for the new chip. These chips are usually clear marked as “Prototype” or “Pre-production”.<\/p>\n \u00a0<\/span><\/p>\n This is a pre-production Intel 8035<\/p>\n \u00a0released at Step level C-1A<\/span><\/p>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n Marketing and engineering samples were often provided to large customers. These chip were nominally to be used to evaluate the new chip design. These chips are may have markings that says “Eng Sample”, “Nor for Sale”, etc. These are often early production chips to used promote the new chip and speed its acceptance.<\/span><\/p>\n \u00a0 <\/span><\/p>\n Other numbers on the chip are related to internal operations of the company and there for tracking and quality control purposes. Unless you have access to internal company records, these numbers are for the most part useless for collecting and hobbyist purposes.<\/span><\/p>\n","protected":false},"excerpt":{"rendered":" Identification Number Primary Intel Format:\u00a0 P\u00a0 AB999\u00a0 (V9 or -9)\u00a0\u00a0 \/M P A B 999 (V9 or -9) \/M Package * Chip ID #, 1st Digit Chip ID #, 2nd Digit Chip ID #, Sequence # Version Control Military Spec Most Common A – Pin Grid Array C – CerDIP D- Ceramic Sandwich P – … <\/p>\n |
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